Intel announced that it will be able to stuff one trillion transistors into an IC package by 2030.
A package is the housing that chips are placed in. They are either soldered to a printed circuit board or plugged into the PCB. One chip die is found inside a package unless it is a Multi-Chip Module. An example of this would be an eMMC flash card which contains flash memory and a flash memory controller.
Intel says that it will be able to keep Moore's Law alive; this is the observation made by Intel co-founder Gordon Moore that originally called for the transistor count in chips to double every year. Moore revised this 10 years later as he looked for transistor counts to double every other year by 1975.
Patton continued,"At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore’s Law alive and well for years to come." One of the most important discoveries in the industry is the replacement of FinFET transistors with Gate-All-Around . Unlike FinFET , current flows can be manipulated on all four sides of the channel and will use vertically stacked nanoribbons.is using GAA for its 3nm chips while TSMC won't follow suit until it starts producing 2nm chips in a few years. Intel, which calls its GAA tech RibbonFET, will start shipping such chips in 2024.
Also helping Intel toward its goal of producing packages with one trillion transistors are new innovations in the packaging of chips with a 10x improvement in density. This will allow a huge increase in the number of transistors that can fit inside a small area.
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