Intel has revealed more details on its 'breakthrough' glass substrate technology - a new way to manufacture processors that will dramatically boost performance
The all-important transistor count will see benefits too - more of them will be able to be packed into smaller spaces allowing for larger chiplet complexes. The glass substrates have ultra-low flatness that improves the depth of focus for lithography - the process that essentially prints or constructs the processor core. This is hugely important as the transistor count directly impacts performance.
Intel's senior vice president and general manager of Assembly and Test Development, Babak Sabi had this to say. “After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come.
It's widely seen as a way to continue Moore's Law - where the transistor count on processors doubles every two years. This has waned in recent years, with smaller manufacturing processes and higher transistor counts being harder to achieve, with manufacturers turning to multiple core processors and 3D stacking techniques to boost transistor counts.
The glass substrates could provide other avenues for boosting transistor counts and in turn performance and the technology can be applied to any processor, while also reducing power requirements. In addition to performance and power benefits, Intel also states that yields should increase too. Sadly, the technology isn't likely to arrive till the latter half of this decade.
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