Intel is rebranding its major tech nodes, moving away from 10nm or 7nm branding in favor of broader “Intel 7” or “Intel 4” names. It also previewed its roadmap through 2025 and its plan to retake the crown as the top chipmaker after a series of delays.
Intel is rethinking how it releases — and brands — its semiconductor innovations, CEO Pat Gelsinger announced today at the company’s Intel Accelerated webcast. The announcement includes the broad strokes of the next half-decade of Intel’s processor roadmap, new chip and packaging technologies, and a promise of an “annual cadence of innovation,” with the ultimate goal of seeing Intel retake its leadership in the processor space by 2025.
Like Intel 4, it’s still a FinFET product, although Intel says it’ll offer additional optimizations and use of EUV for roughly an 18 percent increase in performance-per-watt compared to Intel 4. No release date or product names for Intel 3 chips have been announced yet, but presumably, they won’t be available until 2024. * Intel 20A is the name for the next generation of Intel technologies that, under the old scheme, would have been the architecture following the formerly branded 7nm node.
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